VMANX FPC Compact Datasheet (Two Series)
Document 1: VMANX PI Copper-Foil FPC (VMX-FPC-CU)
High-reliability PI-based flexible circuit compatible with SMT, through-hole components and metal domes. Designed for dynamic bending, high-current and high-temperature operating scenarios.
• Substrate: PI, 12.5/25/50/125 μm
• Conductor: RA copper (flex preferred) / ED copper; 18/35/70 μm (0.5/1/2 oz)
• Coverlay: PI film, 12.5–25 μm
• Surface finish: ENIG (SMT preferred), OSP, Immersion Tin
• Stiffener (optional): FR-4 / PI / Stainless steel
• Current capacity: ~1.4 A (35 μm Cu, 0.3 mm trace, 10 °C rise)
• Insulation resistance: ≥100 MΩ @ 500 VDC
• Impedance control: 50 Ω (single-ended) / 100 Ω (differential), ±10% tolerance
• Min line/space: 75/75 μm; 50/50 μm (0.5 oz Cu)
• Bend radius: Static ≥3× total thickness; Dynamic ≥6× total thickness
• Flex life: >200,000 cycles (RA copper, MIT R0.8 mm)
• Temp range: -40 °C ~ +150 °C
• Solder resistance: 260 °C / 10 s, peak 330 °C reflow compatible
Material cutting → Drilling → PTH → Dry film lamination → Exposure & development → Etching → Stripping → Coverlay lamination → Surface finish → Stiffener bonding (optional) → Cutting & punching → E-test → Packaging
• Prototype: 5–7 working days
• Mass production: 12–15 working days
• MOQ: No strict limit
| Parameter | VMX-FPC-CU (PI Copper) | VMX-FPC-AG (PET Silver) |
| Substrate | PI | PET |
| Conductor | Etched copper foil | Printed silver paste |
| SMT Reflow | ✅ Supported | ❌ Not supported |
| Dome/Spring Contact | Soldering | Conductive adhesive |
| Transparent Version | No | Yes (AgNW) |
| Flex Life | 200k cycles | 50k cycles |
| Temperature Range | -40 ~ +150 °C | -20 ~ +80 °C |
| Max Current | 2 A (1 oz Cu) | ≤0.8 A |
| Impedance Control | Accurate (±10%) | Not feasible |
| Prototype Lead Time | 5–7 days | 3–5 days |
| Volume Cost | Medium | Lower |
Document 2: VMANX PET Silver-Printed FPC (VMX-FPC-AG)
Low-cost, fast-turn PET flexible circuit for low-current signal and simple 1–2 layer designs. Supports optional AgNW transparent layer. Component mounting only via low-temperature conductive adhesive; reflow soldering unsupported.
2. Material & Construction
• Substrate: PET, 50/75/100/188/250 μm (transparent available)
• Conductor: Screen-printed silver paste, 5–15 μm dry thickness
• Protection: UV dielectric ink / low-temp PI coverlay
• Transparent AgNW version: 50–100 Ω/□, ≥89% transmittance @550 nm
• Stiffener: Low-temp bonded PI only (≤100 °C curing)
• Current capacity: ≤0.8 A (10 μm Ag, 1.0 mm trace, thermal limited)
• Insulation resistance: ≥10 MΩ @ 500 VDC
• Impedance control: Not recommended
• Min line/space: 150/150 μm; 100/100 μm (advanced process)
• Bend radius: Static ≥5× total thickness; Dynamic ≥12× total thickness
• Flex life: >50,000 cycles (MIT R0.8 mm)
• Temp range: -20 °C ~ +80 °C
• Solder resistance: Non-solderable (PET low Tg)
PET cutting & corona treatment → Silver printing → Thermal curing → Dielectric/Carbon printing (optional) → Low-temp stiffener lamination → Cutting → E-test → Packaging
• Prototype: 3–5 working days
• Mass production: 7–10 working days
• MOQ: No strict limit (no etching tooling cost)
| Parameter | VMX-FPC-AG (PET Silver) | VMX-FPC-CU (PI Copper) |
| Substrate | PET | PI |
| Conductor | Printed silver paste | Etched copper foil |
| SMT Reflow | ❌ No | ✅ Yes |
| Transparent Option | Yes (AgNW) | No |
| Flex Life | 50k cycles | 200k cycles |
| Temperature Range | -20 ~ +80 °C | -40 ~ +150 °C |
| Max Current | ≤0.8 A | 2 A |
| Impedance Control | Not recommended | Precision ±10% |
| Prototype Lead Time | 3–5 days (fast) | 5–7 days |
| Volume Cost | Lower | Medium |
| Typical Applications | Transparent touch, LED strips, low-power sensors, rapid prototyping | Consumer, automotive, industrial, medical interconnects |
For DFM review and technical support, contact VMANX Engineering.
Dongguan Zhongman Industrial Co., Ltd.
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